Project Co-funded by the European Union’s Horizon 2020


27 Oct 2020 |

EVC1000 presented at the ASME InterPACK 2020 conference

The paper "PHM features for large circuit boards to be implemented into electric drivetrain applications" was prsented at the ASME InterPACK 2020, the online International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems  is the flagship conference of the Electronics and Photonics Packaging Division (EPPD), in technical co-operation with the Japanese Society of Mechanical Engineering (JSME). The conference was organised by ASME, a not-for-profit membership organization that enables collaboration, knowledge sharing, career enrichment, and skills development across all engineering disciplines.

The paper is avalable in the section documents.

Project Co-funded by the European Union’s Horizon 2020

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